E-beam evaporation

During electron beam evaporation (or E-Beam evaporation), evaporant materials are heated to high temperatures through bombardment by high-energy electron streams.

E-beam evaporation is a suitable technique for deposition of materials with the highest evaporation temperatures, including refractory metals and metal oxides. Moorfield’s MiniLab range is ideal for electron beam evaporation.

Moorfield systems for E-beam evaporation:

MiniLab 125

MiniLab 125 tools take the modular concept to the pilot-scale level. Large chambers allow for increased-size component sets for coating large areas, and a range of load-lock options enable high-throughput operation. At the same time, systems are fully customisable to match specific applications.

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MiniLab 090

MiniLab 090 systems are glovebox-compatible for atmosphere-sensitive applications. Tall chambers are ideal for high-performance evaporation, but magnetron sputtering is also available.

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MiniLab 080

MiniLab 080 systems offer tall chambers ideally suited for thermal, LTE and e-beam evaporation techniques requiring longer working distances for optimum uniformity.

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MiniLab 060

The most popular platform in our MiniLab range, MiniLab 060 systems have front-loading box-type chambers ideal for multiple-source magnetron sputtering but also thermal and e-beam evaporation.

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Recent posts about E-beam evaporation:

Metal-insulator-metal diodes based on alkyltrichlorosilane self-assembled monolayers

This paper reports the fabrication metal-insulator-metal (MIM) diodes based on alkyltrichlorosilane self-assembled monolayers (SAMs) and investigation of the effects of parameters such as alkyl chain length on the electronic properties, for applications in high speed electronics.