MiniLab 060

The most popular platform in our MiniLab range, MiniLab 060 systems have front-loading box-type chambers ideal for multiple-source magnetron sputtering but also thermal and e-beam evaporation.

Techniques:

Thermal evaporation, Low-temperature thermal evaporation (LTE), E-beam evaporation, Magnetron sputtering

The MiniLab 060 standard configuration includes a turbomolecular pump positioned on an ISO160 port at the rear of the vacuum chamber. The vacuum chamber sits on a double-rack frame that contains all system control electronics and power supplies. MiniLab 060 systems are available with load-locks—please call for details.

Tools can be equipped with a wide variety of deposition techniques, including thermal and low-temperature evaporation sources (for metals and organics), magnetron sputtering cathodes (for metals and inorganics), and electron-beam sources (for most material classes except organics). Deposition sources are typically mounted on the chamber baseplate, but sputter-down configurations are also available.

Substrate stages, usually at the top of the chamber, can accommodate substrate sizes up to 11” diameter. Substrate heating, rotation, bias and Z-shift are available, together with planetary stages and source and substrate shutters. Configurations range from a manually operated thermal evaporation system up to a multi-technique tool with fully-automated process control.

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Key features

Modular design
Front-loading box-type vacuum chamber
Turbomolecular and cryo pumping systems
Base pressures <5 × 10-7 mbar
Metals, dielectrics and organics deposition
Up to 11” diameter substrates
Touchscreen HMI/PC for system control
Equipped for easy servicing
Comprehensive safety features and interlocks
Cleanroom compatible
Load-locks available

Options

Pumping: Turbomolecular or cryogenic high-vacuum pumps, rotary or scroll backing pumps.
Gas/pressure: Manual or automatic control via MFCs and throttle valves.
Load-locks: Single- and multiple-sample.
Stages: Rotation, heating, cooling, Z-shift, bias and planetary.
Shutters: Source and substrate, pneumatic or motorised.
Operation: Manual or automatic via front panels, touchscreen HMI or PC.
Process: Quartz crystal sensor heads for rate/thickness monitoring or feedback-loop control.

Typical configurations

Thermal evaporation (metals):
Four-source TE4 thermal evaporation component with source shutters and rotation stage. High power TEC-4A power supply and controller with recipe-based automated control. Quartz crystal sensor head with PC software for rate/thickness monitoring.

Thermal evaporation (metals and organics):
Two TE1 thermal evaporation sources for metals and two LTE-1CC components for organics. Source shutters and rotation stage. Evaporation power supplies linked to quartz crystal sensor head and Inficon SQC-310 process controller for automated process control per user-defined rates/thicknesses.

E-beam evaporation:
Multi-pocket (e.g., 6 × 7 cc or 8 × 4 cc) water-cooled e-beam source with 5 kW power supply/controller and automated pocket selection. Source and substrate shutters, and rotation. Quartz crystal sensor heads with Inficon SQC-310 process controller for automated process control per user-defined rates/thicknesses.

Magnetron sputtering::
Up to four water-cooled magnetron sources for 3″ circular targets. RF and DC power supplies with SputterSwitch technology for shared outputs. Source shutters and substrate rotation. Recipe-based power vs. time process control.

Service requirements

All MiniLab 060 tools require chilled water, dry compressed air, nitrogen for venting (optional) and electrical power (three-phase for e-beam evaporation). Sputtering systems also require process gases (argon, oxygen and nitrogen). Exact requirements will be provided with quotations or on request.