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Vacuum deposition Components and systems

AS3000V sample cleaning /  mini dry etch system

  • Twin Filament

  • Minimal surface damage

  • Variable working distance

  • Variable ion beam energy to 3000eV

  • Cost effective multi purpose ion source

 

Where high etch rates are required for sample cleaning and preparation, the user may select higher beam current and/ or beam energy levels from the AS3000V. The source is focusable down to a spot size of circa 5mm ( dependant upon working distance) or it may be broadened out for flood cleaning and etching.

Technical Specification:

Source type: Hot filament oscillating electron discharge source. Twin filaments for extended service interval, user replaceable.
Feed Gas: Inert gases
Gas Inlet: NW19 conflat port at ground potential. Precision leak valve required ( better than 5 x 10-7E mbar across seal). Purge line and purifier recommended.
Cooling: No source cooling required
Lifetime: Typically 3 months for filament replacement, 12 months for source strip and clean.
Pumping: No special pumping required. Typical analysis chamber pressure 1 x 10-5E mbar
Source lens: Extractor/ accelerator lens design.

 

Mechanical specification:

Working distance: 100mm +/- 50mm
Flange to sample: 250 mm +/- 50mm
Mounting flange: NW35 conflat
Electrical feed throughs: 10 way military spec plug
Minimum port i/d: 37mm
Construction: all UHV compatible stainless steel
Bakeout temperature: 200 deg C
Orientation: any

Control and power unit:
19 inch rack mount painted steel box, 3U height
115 VAC or 230 VAC selectable
Filament: 0-3A
Discharge: 20mA - 100mA variable.
Beam potential: Continuously variable between c200eV and 3000eV
Extractor: 0-3000 V continuously variable.

 

PRICE

Description Order Code Price (UKŁ) Price (US$) Price (Euro)
Package AS3000P 7,500 12,750 12,375
Source only AS3000S 3,500 5,950 5,775
Control Unit AS3000PSU 4,265 7,250 7,037

 

 

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Last modified: January 12, 2007
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