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The RIE600 is a compact etch electrode designed
for easy retrofit to any existing vacuum coater, allowing the user
access to a simple in situ etch facility within a deposition chamber.
For users with sputter facilities within the chamber, there is no need
to add gas admission, pressure control or RF power as this is already
available.
The aluminium electrode is insulated by PTFE
from an earthed dark space shield mounted on top of an HT electrical
feed through. UHV flanges are employed to enable the insulated copper
conductor to be at atmosphere inside of the mounting tube thus
preventing high gas load trapped volumes.
The mounting tube carries a vacuum gland
suitable for 1” base plate port connection which terminates in a
standard “N” type electrical connector. The mounting tube allows for
variable height adjustment of the electrode relative to the sample /
chamber / sources.
In its simplest form the sample is placed on top
of the electrode, gas admitted to the chamber to a pressure of circa
100mbar and RF power induced at the electrode. The plasma ignites and
excited carrier gas ions impact upon the sample surface etching it away.
The electrode achieves best results at circa
1W/cm2 thus
does not require a high specification electronic unit to drive it.
Control system:
RIE600C: A
bench mount 100W RF unit with auto-matching unit for control of
reflected power. Single phase mains input.
Accessories:
High temperature cable – 1mtr long with
“N” type screw connector
both ends.
1” base plate vacuum gland in stainless steel
with Viton O rings.
1” base plate vacuum gland in aluminium with
Viton O rings.
Associated products:
MSSK-8MM Manual sample shutter kit - 8 mm drive, lever, height
adjuster, Shutter plate.
ASSK-6MM Pneumatically operated sample shutter kit - 6 mm
drive, 1” bolt rotary feed through with adjustable pneumatic
actuators, height adjuster, Shutter plate.
TORUS
Magnatron source. Choice of 2” to 6” sputter source
for DC and/or RF sputtering. Flexihead option for attitude adjustment.
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