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MiniLab for
E-Beam, thermal, low temperature
thermal, high temperature thermal, sputter thin film deposition and in situ etch
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MiniLab 25 series
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A turbo pumped bench top or floor mounted vacuum deposition system designed for entry level
thin film and small scale R&D applications. The system utilises the MiniLab
"plug and play" concept for all components and technical configuration and
mechanical chamber geometry can be readily changed. The basic system requires no water or special services, just a 230
vac 10A supply and 1100mm x 600mm desk space |
MiniLab 60 series
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The smallest of our pilot line systems - but don't be fooled by its small
footprint. It can pack 4 x 3" sputter sources and a 300mm substrate into the
chamber. Configurations range from a manually operated thermal system up to
automated process control |
MiniLab 80 series
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For users requiring greater deposition "throw" (distance from source to
substrate), the 080 series with D shaped front loading chamber offers an
additional 150mm giving a total working distance of up to 450mm making this
chamber the ideal choice for e-beam and LTE deposition. Load lock options
are available on this series. |
MiniLab 125 series
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Launched new in 2010, the 125 series is a true contender for small batch
production in a professional environment. The D shaped front loading chamber
is water cooled / heated and allows for fast cycle times, whilst the
"plug and play" MiniLab modular design concept gives rapid tool change
availability... and all at a very competitive price. Load lock options are
available on this series. |
PECVD Systems
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The addition of the high stability gas admission and management components
to the MiniLab range has enabled us to offer an R&D PECVD system. Up to 4
gas lines, PLC control and a 1200C heater with RF bias. Check it out! |
Pumping options: turbo wet, turbo dry,
or cryo.
Load lock options: single sample
transfer, platen transfer, cassette loader
Platen options: rotation, heating
(graphite, ceramic, quartz, front side, rear side), cooling ( glycol -5C,
LN2), Bias ( DC/RF in situ etch), Z shift, motorisation.
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