| The Magitron3 and Magitron2 are 3” and 2" cathode sized
magnetron sputtering heads designed for use in HV sputter systems for
sputter up or sputter down configurations. The device is extremely
flexible in its use due to innovative design.
Key points are: RF, DC, and Pulsed-DC operation.
Balanced or unbalanced operation of magnetic sputter targets.
Flexi-head (±45°) with low profile for larger working distance.
Standard models accommodate sputter target thicknesses from 1/16" to
¼”.
Wide operating pressure range with low out-gassing rate.
Excellent thin film uniformity and deposition rates.
Efficient sputter target utilization.
No special sputter target requirements (thermal pastes, keepers,
etc).
Modular magnet array - high strength option for magnetic material
deposition.
Magnets are NOT exposed to vacuum
Technical Specification:
Material: Body - 304 stainless steel
Bellows - 316 stainless steel
Magnet housing – OFC
Insulators – PEEK/ PTFE
Seals – viton
Max
power*: RF – 6.5 W/ CM2
DC –
70W/CM2
Cooling: Water, 6mm push on fittings
Connection: N Type screw terminal
* power is dependant upon the target material.
Particular attention should be paid to the thickness of the target and
the materials thermal conductivity.
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